The use and the application of a Heatsink are often understated as only a lack proper one would actually show you how important they are. Furukawa Electric Co Ltd exhibited a new heat sink for the PlayStation 3 (PS3), a game console developed by Sony Computer Entertainment Inc (SCE), at Techno-Frontier 2008. The third-generation heat sink for the PS3 has already hit the productions stage and that is only good news for the gaming enthusiasts.
The third-generation product is characterized by its small size, light weight and low cost. The heat sink developed by Furukawa Electric is used to cool the microprocessor “Cell” and graphics LSI “RSX.” When Nikkei Electronics Teardown Squad disassembled the PS3 in November 2006, this heat sink, together with a large cooling fan whose diameter is more than 13cm. The new PS3 has a cell produced in 65nm process technology to reduce the cost and power consumption. This makes it a lot cooler and a lot better with a lot less noise.
In the first and second-generation products, a large heat sink cooled both the Cell and RSX. But they are cooled by separate heat sinks in the third-generation product. Furthermore, copper heat pipes, which were used in the first- and second-generation heat sinks, are no longer used in the third-generation product. This doing away with the pipes further helped the new technology. The III generation heat sink also come in with just 3 components and weighs just 350 gm to make it a lot more efficient. All in all, we have one wonderful piece that enables gamers to go out and have lot more fun than ever before.
